Understanding the root cause of failures is critical to improving product reliability, yield, and performance. Our infrared thermography-based failure analysis enables rapid identification of hidden defects without damaging the component.
Using advanced thermal imaging systems such as TIFAS IR, we detect anomalies in heat distribution that reveal structural, electrical, and material issues. This allows engineers to diagnose problems early, reduce iteration cycles, and make informed design or process decisions.
We provide high-resolution, non-destructive failure analysis for a wide range of materials and electronic components.
Core capabilities include:
- Detection of thermal anomalies at micro and macro scales
- Localization of defects without physical contact
- Analysis under real operating conditions
- Fast screening for production and R&D environments
- Support for both single-sample investigations and batch analysis
Typical detectable defects:
- Voids and inclusions
- Cracks and fractures
- Delamination and interface failures
- Electrical hotspots and leakage paths
- Thermal bottlenecks and inefficiencies
METHODS & TECHNOLOGY
Our approach is based on advanced infrared thermography techniques combined with controlled excitation and high-sensitivity detection.
Key methods:
- Active thermography (externally stimulated thermal response)
- Lock-in thermography for high signal-to-noise defect detection
- Transient thermal analysis for dynamic behavior
- High-resolution IR imaging for precise localization
Technology advantages:
- Fully contactless measurement
- No sample preparation required
- Applicable to complex geometries and layered structures
- Compatible with in-situ and operational testing
APPLICATION AREAS
Our failure analysis services support a wide range of industries and use cases where reliability and performance are critical.
Electronics & Semiconductors:
- PCB defect localization
- IC and package failure diagnostics
- Power electronics thermal issues
Advanced Materials & Composites:
- Delamination detection
- Structural integrity assessment
- Bond quality evaluation
Manufacturing & Quality Control:
- Inline or offline defect screening
- Process validation and optimization
- Yield improvement analysis
R&D and Product Development:
- Prototype validation
- Design verification
- Root cause analysis of early failures
WHAT YOU GAIN
Our failure analysis service is designed to deliver actionable insights, not just measurements.
You benefit from:
- Faster root cause identification
- Reduced need for destructive testing
- Lower development and debugging costs
- Improved product reliability and lifetime
- Data-driven decision making for design and process improvements
We translate thermal signals into clear engineering conclusions, enabling you to act quickly and confidently.
WHY US
We combine deep expertise in thermography with advanced instrumentation to deliver reliable and reproducible results.
What sets us apart:
- Specialized know-how in infrared-based failure analysis
- Use of high-end systems such as TIFAS IR
- Strong understanding of electronic and material systems
- Tailored analysis approaches for each application
- Clear reporting focused on engineering decisions
Our goal is not only to detect defects, but to help you understand and eliminate them.
Identify Failures Before They Become Costly Problems
Talk to our experts about your specific application and discover how infrared thermography can accelerate your failure analysis process.