Thermal characterization of materials from the wide domain of electronics is a key competence of Nanotest. For different material classes we develop, refine and utilize methods and measurement systems, empowered by scientific judgement. We flexibly adapt to customer requirements and provide economical service offers for very individual studies.
Thermal interface materials
TIMs - thermal interface materials - are the key component to ensure thermal performance and reliability of electronics. Every application comes with unique TIM requirements and good choices can only be made based on good data. We acquire such data.
Application-related characterization of TIMs is described in the
standard ASTM D5470 and the measurement systems TIMA 5 and 6 fully implements that standard. This includes precise heat flow control, thickness resolution in 1 µm range and sample compression of up to 3.4 MPa (500 PSI).
Bulk thermal properties
Characterization of TIMs, provided in different thicknesses, allows to directly determine the bulk thermal conductivity and the thermal interface resistance. This applies to most classes of TIMs, especially silicon-based pastes, pads and curing gap fillers. But with smart sample preparation and treatment, adhesives, molding compound, underfill material and similar materials are characterizable this way, too.
Effective thermal properties
The overall thermal resistance and effective thermal conductivity can be determined as function of the temperature or mechanical load (compression or tension). Also laminates or compounds are feasible samples for such analyses.
Aging investigation
The durability of TIMs is an essential material characteristic. Depending on their application, TIMs can see greatly different operation temperatures and mechanical loads. It is important to evaluate the expectable lifetime by conducting purposeful aging tests that load TIMs periodically by varying the gap width, the clamping pressure or the operating temperature. With
our TIMA 5, the TIM's thermal performance can be monitored in-situ to observe the process of degradation, in particular through pump-out, dry-out and delamination, with maximum detail.
Out of the box
Beyond standards and standardized measurements, TIMs may face several challenges that need proper attention. What about tilted surfaces? Can we find out how much faster the grease will pump out at 10% tilt? Or can we check if this metal-based TIM needs 500 or rather 5000 cycles to fully burn-in? Is it possible to quantify, how much better is the thermal contact resistance between these substrates with the aid of liquid metal?
Well, yes we can. These are mere examples, but we are not limited to prescribed procedures from international standards.
Liquids and viscous material
The thermal properties of liquids are relevant for coolant fluids or similar applications, where the liquid is supposed to carry out a specific task such as conducting and carrying heat away from a source. Thermal characterization of liquids, on the contrary, is not limited to such applications.
Materials like epoxy resins often serve purposes where the thermal performance is an important factor. Characterizing these materials in liquid and solid state, as well as during the curing process may provide insights on the effectiveness of filler particles, the chemical formula or the applied curing temperature profile.
Bulk thermal properties
Using the 3-omega method in our
measurement system TOCS allows to easily characterize liquids, pastes, glues – viscous material in general – and to determine their bulk thermal conductivity and diffusivity at a go. These measurements can be done spatially resolved, temperature-dependent, repeatedly over a period of time and even while applying a temperature gradient through the sample.
This way, the impact of filler particle concentration can be quantified, the pace and quality of the curing at different temperatures be compared and many more fascinating correlations be explored.