Why TIFAS IR Lab?
Electronic reliability hinges on the integrity of thermal pathways. With TIFAS IR Lab you get instant, non‑destructive insight into a component’s thermal behavior, letting you spot hidden defects before they cause failure.
- Speed – Pulse, pulse‑phase, and lock‑in thermography all in seconds.
- Precision – Smart image‑processing identifies even subtle anomalies.
- Versatility – Works with electrical parts, mechanical assemblies, and connections alike.
Core Technology
Pulse Thermography
Quick, high‑contrast imaging of shallow defects.
Pulse‑Phase & Lock‑In
Detect deeper or periodic anomalies with high signal‑to‑noise.
VacBlack System
Select from two types of VacBlack® film: 50 µm & 30 µm thickness to eliminate emissivity issues.
Why Choose TIFAS IR Lab?
- Desktop‑Scale Lab – Bring full‑scale failure analysis into your office or lab.
- Intelligent Software – Automated image analysis speeds decision‑making.
- Non‑Destructive & Contact‑Free – Preserve samples for repeat testing or further analysis.
- All‑In‑One Package – No need for multiple instruments; the system is ready to use out of the box.
What TIFAS IR Lab Detects
Voids
Cracks
Delamination
Inclusions
Foreign objects
Applications
In the semiconductor industry, TIFAS IR Lab is used for early defect detection in wafers and packages. Power electronics benefit from thermal hotspot mapping in modules and PCBs, while automotive applications focus on inspecting thermal bridges in electrical connectors. Aerospace teams use the system to assess composite integrity and joint reliability, and research and development laboratories rely on it for rapid prototyping and failure analysis.